OUR TECHNOLOGY

Aifotec AG develops packaging and assembly concepts for photonic and semiconductor components with the focus on high-precision fully automated assembly. According to our suppliers, we use state-of-the-art equipment which we specify, select, and improve for optimal implementation of customer requirements. We support all leading-edge process benches such as glass, ceramic, polymer, and silicon using laser spot size die bonding as well as oven-based heating and epoxy bonding technologies.

Laser-Based Spot Size Eutectic Bonding

Laser-based spot size bonding enables a precise and passive assembly down to ± 0.5 µm @ 3 sigma. Local heat-penetration by the laser system guarantees a very fast eutectic bonding process with less oxide generation and less heat impact to adjacent areas. By means of an eutectic alloy highly controlled and precise placements with a high reliability, bond strength, and yield are feasible.

Technical Specifications

  • Cycle time depends on the process parameters
  • Variable laser spot size and shape
  • Adjustable temperature profiles up to 1000 °C
  • Heatable pick up tool up to 350 °C
  • Bond force from 3 g–500 g
  • Adjustable process gas

  • Device pick up from waffle and gel pak or blue tape
  • Customized platforms and trays, full wafer up to 8"
  • Customized pick up tools enable wide range of devices
  • Flip chip capability

  • Post bond accuracy measurement
  • Shear force measurement
  • Wafer mapping
  • Data tracking

Heat Plate-Based Eutectic Bonding

Eutectic bonding by a heat plate-based system enables e.g. large device assembly with a precision down to ± 1.5 µm. By means of an eutectic alloy highly controlled and precise placements with a high reliability and yield are feasible.

Technical Specifications

  • Cycle time depends on the process parameters
  • Large area heat plate of up to 2,5"
  • Adjustable temperature profiles up to 400 °C
  • Bond force from 30 g–150 g
  • Adjustable process gas, formic acid or forming gas

  • Device pick up from waffle and gel pak
  • Customized platforms and trays, full wafer up to 6"
  • Customized pick up tools enable wide range of individual devices

  • Post bond accuracy measurement
  • Shear force measurement
  • Wafer mapping
  • Data tracking

Epoxy Bonding

Adhesive bonding by means of a light curing or conductive epoxy enables a passive assembly with a precision down to ± 1.5 µm e.g. devices like VCSELs, lenses, or injection moldings into cavities or every substrate of your choice.

Technical Specifications

  • Cycle time depends on the process parameters
  • Dipping and dispensing system with various tools
  • Bond force from 30 g–150 g
  • Installed UV- curing system

  • Device pick up from waffle and gel pak
  • Customized platforms/trays, full wafer assembly up to 8"
  • Customized pick up tools enable wide range of individual devices

  • Post bond accuracy measurement
  • Post thermal treatment up to 300 °C
  • Shear force measurement
  • Wafer mapping
  • Data tracking

Fibre Coupling

Active opical coupling of single fibres or even fibre arrays to your chip or platform is realised by a semi-automated station and bonded with a light curing epoxy. Accordingly to the active coupling, we passivly assemble active optical cables with the smallest outer dimensions with our patented technology.

Technical Specifications

  • Active alignment and coupling
  • Cutomized substrate and fibre holder
  • Light curing epoxy bonding with UV-source
  • Post thermal treatment up to 300 °C
  • Wavelength measurement
  • Polarization measurement
  • Power measurement
  • Laser controller
  • SLED source

Contact

Aifotec AG

Herpfer Straße 40
D-98617 Meiningen
Germany

Phone: +49 (0)3693 8813-180
Fax: +49 (0)3693 8813-176
info(at)aifotec.com

Executive Board

Dr. G. Vollrath (CEO)
K. Ochner (CFO)

Supervisory Board

M. Fischer (chairman)
W. Schwaiger
K.  Berka